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Copper additive manufacturing | Suzhou, China

Copper 3D printing for functional parts

We manufacture pure copper and copper-alloy parts from your CAD, with engineering support for DFM, thermal and flow analysis, and design iteration. Send CAD or a thermal brief for an engineering review and scoped quotation.

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DFM and thermal design support Pure copper and copper alloys Prototype and production NDA on request · reply within 2 business days
Pure copper and copper alloy additive manufacturing parts

Process

Green-laser LPBF

Materials

Pure Cu · CuCrZr

Output

Inspected parts

Service

Copper AM production

Scope

Print · machine · inspect

Start

CAD or thermal brief review

01 | Who we are

A copper AM service built around finished parts

COPPER 3DP is the copper additive manufacturing service of Suzhou Como Precision Materials Co., Ltd. We review the drawing, manufacture the part, complete downstream operations, and supply the agreed inspection evidence.

The engineering discussion stays focused on the part: function, geometry, material state, downstream operations, acceptance evidence, quantity, and timing.

Send your drawing

Engineering and DfAM

Review geometry, internal channels, material route, supports, powder removal, datums, and acceptance risk.

Green-laser LPBF

Produce commercially pure copper and copper alloy parts on a platform matched to the geometry.

Finishing and machining

Define heat treatment, support removal, CNC features, sealing faces, threads, polishing, or plating.

Inspection and delivery

Agree dimensional, CT, pressure, leak, flow, conductivity, surface, and documentation requirements.

02 | What we make

Functional copper parts for heat, current, flow, and tooling

We manufacture prototypes and production parts when internal channels, compact heat-transfer area, shaped current paths, or part consolidation make conventional fabrication inefficient.

Thermal management

Cold plates, compact heat exchangers, heat sinks, cooling blocks, and integrated manifolds.

Semiconductor cooling

Cooling plates, heat spreaders, compact manifolds, and hardware for power electronics.

Electrical and induction

Induction coils, busbars, electrodes, shaped current paths, and high-current components.

RF and vacuum

Waveguides, RF cavities, conductive structures, and vacuum-facing copper hardware.

Flow and nozzle hardware

Nozzles, injectors, manifolds, flow distributors, and parts with integral cooling passages.

Tooling and high-heat hardware

Conformal-cooling inserts, thermal tooling, and copper-alloy structures for demanding environments.

03 | Thermal design support

From thermal requirements to manufacturable copper cooling hardware

A project can start with finished CAD or with heat load, temperature limits, coolant, flow or pressure-drop targets, available envelope, and interfaces. We turn those inputs into a scoped design, manufacturing, and validation route.

The selected geometry is project-specific. More surface area does not automatically mean better cooling once pressure drop, flow distribution, cleanability, and printability are considered.

Review the complete thermal design and validation workflow, or continue with the commercial paths for copper cold plates and copper heat exchangers.

  1. 01

    Define the conditions

    Map heat sources, duty cycle, temperature limits, coolant, flow or pressure limits, envelope, and interfaces.

  2. 02

    Compare architectures

    Assess channels, fins or microchannels, impingement, manifolds, and topology-led structures against the constraints.

  3. 03

    Iterate the design

    Balance thermal response, uniformity, pressure drop, strength, powder removal, machining, and inspection access.

  4. 04

    Prepare validation

    Define the agreed CAD and drawing scope, manufacturing route, prototype plan, and included simulation or test evidence.

Architecture, reconstruction, and evidence

Three gates before the cooling geometry is frozen

Metal AM expands the available surface, fin, and channel design space. The value is realized only when the thermal concept can be simulated under defined conditions, rebuilt as manufacturable geometry, and tied to an agreed validation plan.

Thermal-fluid simulation showing flow distribution through a topology-led cold-plate channel network

Reference study | flow field

Screen the flow architecture

A topology-led path is a concept, not a guarantee. Compare flow coverage, local velocity, and pressure loss under the agreed coolant and boundary conditions.

Two reconstructed topology-optimized cold-plate channel layouts with inlet and outlet arrows

Reference study | model reconstruction

Rebuild usable channel geometry

Convert optimization output into continuous passages with practical walls, powder exits, port transitions, machining stock, and inspection access.

Physical prints of reconstructed topology-optimized cold-plate channel layouts from the supplied reference study

Reference study | physical print

Plan manufacturing evidence

Use the physical build to review feature continuity, channel access, edge conditions, cleaning or powder removal, and the dimensional, flow, leak, or thermal checks needed before the design is frozen.

Two valid starting points

Bring CAD or bring the thermal boundary conditions

Existing CAD moves into DfAM and production review. A thermal brief starts with concept development before the prototype route is agreed. Performance targets remain tied to agreed inputs and project-specific validation.

Useful design inputs

  • Heat load, source map, and duty cycle
  • Temperature or thermal-resistance target
  • Coolant, inlet conditions, flow, and pressure limits
  • Envelope, ports, interfaces, and working pressure
  • Material preference, quantity, and validation needs

04 | Production capability

Green-laser LPBF matched to your drawing

The drawing determines the material route, build class, orientation, supports, powder-removal strategy, and downstream operations. The quotation records the route selected for that part.

Copper LPBF process, build progression, and finished-part geometry. Send your drawing for review

Laser route

532 nm green laser

Process route for reflective copper and copper alloy systems.

Build classes

5 envelope ranges

From compact development work to large-format production.

Largest build class

660 × 660 × 1300 mm

Final fit still depends on orientation, supports, and access.

Materials processed

Materials selected for the finished-part requirement

Conductivity, strength, temperature, heat treatment, final state, and acceptance method are reviewed together. Feedstock selection is one input to the finished-part manufacturing route.

Check your material and part
Commercially pure copper powder used as LPBF process feedstock

Commercially pure copper

Selected when thermal or electrical conductivity is the primary design driver.

CuCrZr copper alloy powder used as LPBF process feedstock

CuCrZr / CuCr1Zr

Selected when conductivity must be balanced with strength and thermal stability.

CuCrNb copper alloy powder used as LPBF process feedstock

CuCrNb

Assessed for application-specific copper alloy and elevated-temperature requirements.

Build capacity

Build capacity from compact to large-format parts

The final build class is confirmed after part size, material, geometry, quantity, and current production requirements are reviewed.

Compact
Ø100 × 100 mm
Precision
160 × 160 × 200 mm
Mid-format
350 × 350 × 500 mm
Multi-laser
400 × 400 × 400 mm
Large-format
660 × 660 × 1300 mm

05 | How we work

One route from requirements to delivered part

The process is locked around the agreed inputs, drawing, and acceptance criteria, so design, printing, post-processing, inspection, and quotation describe the same deliverable.

  1. 01

    Define the requirement

    Send CAD or, for thermal-design work, the governing operating requirements, envelope, interfaces, quantity, and acceptance needs.

  2. 02

    Lock the route

    For scoped thermal-design projects, we develop and iterate cooling geometry before fixing the material, DfAM, finishing, and test route.

  3. 03

    Print and finish

    The part moves through green-laser LPBF, support removal, heat treatment, CNC, and specified finishing.

  4. 04

    Inspect and deliver

    Inspection evidence is produced against the agreed scope before packaging and international delivery.

Engineering review

Start with CAD or a clear thermal brief

Add quantity, target timing, heat load or operating conditions, and the requirements that cannot be compromised.

Send CAD or thermal brief

06 | Parts and applications

Copper geometry designed around the job

These part forms show where copper LPBF is most useful: compact thermal structures, integrated flow features, shaped current paths, and geometries that remove joints or assembly steps.

Copper honeycomb and lattice heat-exchange geometry

Heat-exchange structures

Dense surface area, compact flow paths, and monolithic thermal cores.

Additively manufactured copper induction coils and conductive paths

Induction and conductive paths

Integrated cooling, shaped current paths, and repeatable coil geometry.

Additively manufactured copper nozzle with fine external flow features

Nozzles and flow hardware

Internal passages, consolidated bodies, and heat-flux-focused geometry.

Copper additive manufacturing parts with fins, lattices, channels, and thin walls

Fins, lattices, and integrated features

Geometry that combines thermal, structural, and fluid functions in fewer pieces.

07 | Start a project

Send CAD or thermal requirements for engineering review

Submit what is already known. If CAD is not yet available, provide the heat load, temperature target, coolant, flow or pressure limits, available envelope, and interfaces. Quantity, material preference, inspection, and target timing help us return a clear scope.

What you get back

  • Route check

    We confirm whether LPBF is the right route for the part, and say so when CNC, skiving, or brazed copper is the better choice.

  • DFM feedback

    Wall, channel, fin, support, powder-removal, machining-stock, and inspection-access issues are marked before pricing.

  • Scoped quotation

    Material route, heat treatment, machining, finishing, inspection, and delivery scope, or focused questions if inputs are missing.

Secure RFQ submission

Start your copper AM inquiry

Tell us what the part needs to do. Start with your contact details and a short brief; CAD and additional project details are optional.

  • Response: we reply within 2 business days.
  • Confidentiality: we can sign your NDA before you share CAD. Mention it in the brief and send contact details first.
  • Useful files: STEP/STP, X_T/X_B, IGES, STL, or PDF drawings.
  • Upload limit: up to 3 files, 5 MB each, 8 MB total.
  • Sensitive projects: do not send export-controlled, classified, or restricted data before an approved handling agreement is in place.

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Optional email template

Copy this into your own email if useful. Send the drawing and what you know; leave unknown fields blank.

Open email
Subject: Copper 3D printing RFQ - [part name]

Hello COPPER 3DP,

Please review the attached CAD/drawings for quotation.

Part/application:
Attached files:
Quantity:
Material preference, if known:
Target lead time:
Critical dimensions or surfaces:
Operating conditions:
Inspection or test requirements:
Post-processing expected:

Notes:

Best regards,