Technical content
Browse by application or engineering decision, then open the guide closest to the part, requirement, or acceptance question you are working through.
24 engineering guides
Cold plates, heat sinks, heat exchangers, internal channels, data-center cooling, and power modules.
An anonymized design-review case: a four-branch Ø5 mm housing cooling channel for a 12.5 kW permanent-magnet motor, with loss inputs, CFD setup, 13 kPa pressure loss, and why an air-gap model update moved the predicted magnet peak by about 78 K.
Prevent service-life clogging in copper AM microchannel cold plates by linking the smallest vulnerable passage to coolant contamination, filter performance, flushing, flow baselines, and maintenance access.
Select copper material, coating, seals, and validation for a SiC module cold plate from the complete mixed-metal coolant loop, not from copper thermal conductivity alone.
Verify multi-passage copper AM heat exchangers with branch-sensitive flow evidence, not total flow alone. Define maldistribution metrics, test boundaries, instrumentation, and correlation.
Design cold plate ports and seals as a combined printed, machined, cleaned, and pressure-tested interface with adequate remaining wall, datum control, and tool access.
Busbars, coils, conductive parts, electrodes, waveguides, cavities, RF surfaces, and vacuum hardware.
How copper induction coils are made and how they work—and when printed current paths and cooling channels justify replacing bent tube or brazed assemblies.
Plan copper AM qualification coupons by the risk they represent, their build location and orientation, final processing state, measurement method, and relationship to part-level acceptance.
A procurement-ready method for specifying copper AM parts when minimum conductivity and mechanical properties must be achieved in the same delivered material state.
Co-design copper AM plasma hardware across RF current, vacuum conductance, cooling, sealing, surface, cleaning, outgassing, and final RF-vacuum acceptance.
Specify copper AM waveguide surfaces by RF-current sensitivity, frequency band, geometry, access, conductivity, and final coating state instead of one cosmetic roughness value.
Co-design dielectric barriers, copper heat paths, coolant passages, datums, seals, cleanliness, and final electrical safety tests for onboard charger and DC-DC cooling blocks.
Build a copper AM waveguide tolerance budget across printed internal profiles, bends, twists, machined flanges, plating, cooling walls, datums, and final RF measurement.
Wafer equipment, clean thermal hardware, mold inserts, conformal cooling, and tooling hot spots.
Release copper AM semiconductor metrology components by controlling final flatness, temperature, datum transfer, internal cleanliness, material state, records, deviations, and repeat-build changes.
Pure copper, CuCrZr, CuCr1Zr, laser processing, geometry limits, CAD, heat treatment, and post-processing.
A buyer checklist for copper-alloy rocket combustion chambers and liners: identify the end user, document the end use, and resolve export approval before committing to manufacture.
A field-informed release guide for pure copper, CuCrZr, and GRCop LPBF thermal hardware, covering powder traceability, channels, post-processing, CT, leak, flow, and thermal evidence.
How to separate functional datums, temporary manufacturing references, and inspection features so a copper LPBF drawing remains measurable through finishing.
A decision framework for orienting and supporting copper LPBF parts with thin walls and enclosed channels without creating trapped supports, damaged interfaces, or untestable flow paths.
A pre-quotation go/no-go framework for rejecting, revising, conditionally quoting, or redirecting copper parts when LPBF cannot deliver a credible finished component.
Plan copper 3D printing lead time as a gated critical path covering requirements, DFM, build allocation, heat treatment, machining, cleaning, inspection, and repeat-build controls.
Qualify a copper LPBF supplier for conductivity-critical parts by defining the finished material state, test method, coupon relevance, interfaces, acceptance evidence, and change controls.
Specify pure copper LPBF as a delivered material and functional state: test method, temperature, direction, specimen relationship, interfaces, finishing, and part-level acceptance.
Quotation inputs, tolerances, cleaning, CT, leak testing, cost drivers, and acceptance evidence.
A finished-part method for budgeting channel position, process movement, machining, and inspection when a copper AM port approaches a hidden flow path.
A seven-gate DFM workflow for copper AM parts with hidden channels, covering route value, channel mapping, depowdering, finishing, inspection, and quote readiness.
Choose proof, helium leak, pressure-decay, bubble, flow, CT, and burst tests from the failure question each can answer, then define final-state conditions and acceptance.
