Engineering glossary
Consistent copper AM language for design, quality and procurement
These definitions establish a common baseline for an RFQ and technical review. A term does not replace the exact material standard, test method, acceptance limit or supplier process specification required by a project.
Evidence library version 2026-07-16. Public values remain source-specific references, not universal part guarantees.
- Defined terms
- 30
- Topic families
- 5
- Shared vocabulary
- 1
- Implied guarantees
- 0
A-Z reference
Terms used across the knowledge center
- AM
- Manufacturing by adding material from digital geometry, usually layer by layer or bead by bead.
- As-built
- The condition directly after printing and before post-processing.
- Binder Jetting
- A binder forms a green part in a powder bed before debinding and sintering.
- Build plate
- The substrate that supports initial layers and provides thermal and mechanical restraint.
- Cold Spray
- Solid-state deposition by accelerating particles onto a substrate at high velocity.
- CT
- Industrial X-ray computed tomography used to examine internal defects and channels.
- Cu-ETP
- Electrolytic tough-pitch copper; oxygen content and hydrogen-embrittlement risk must be considered.
- Cu-OF / OFHC
- Oxygen-free high-conductivity copper; confirm the exact grade, purity and specification.
- CuCrZr
- A precipitation-strengthened copper-chromium-zirconium alloy balancing strength and conductivity.
- DED
- Material is delivered into a focused energy source and deposited while melting.
- E-PBF / PBF-EB/M
- Electron beam powder bed fusion of metals.
- GRCop-42
- A NASA-developed Cu-Cr-Nb alloy family for high-temperature, high-heat-flux structures.
- GRCop-84
- A Cu-Cr-Nb alloy with higher chromium and niobium content than GRCop-42.
- Hatch spacing
- Center-to-center spacing between adjacent fill scan tracks.
- HIP
- Hot isostatic pressing uses high-pressure gas and heat to reduce internal porosity.
- IACS
- Conductivity expressed relative to the International Annealed Copper Standard; report temperature and method.
- Keyhole
- A deep vapor cavity formed in a high-energy melt regime; collapse can create pores.
- Lack of fusion
- Irregular defects caused by incomplete melting or insufficient overlap.
- Layer thickness
- Nominal thickness of each deposited or spread layer.
- LPBF / PBF-LB/M
- Laser beam powder bed fusion of metals.
- PBF
- The powder-bed-fusion process family, including laser- and electron-beam routes.
- PSD
- Particle-size distribution, commonly described with D10, D50 and D90.
- Recoater
- The mechanism that spreads a fresh powder layer across a powder-bed system.
- Relative density
- Density relative to a theoretical reference; the method and acceptance threshold must be stated.
- Scan speed
- Beam travel speed; it must be interpreted with power, spot, path and layer conditions.
- Stress relief
- Heat treatment intended to reduce residual stress.
- UAM
- Solid-state joining of metal foils using ultrasonic plastic deformation.
- VED
- A simplified volumetric-energy-density term, often P/(v x h x t), that does not capture the full process physics.
- WAAM
- Large-format directed energy deposition using wire feedstock and an electric arc.
- Witness coupon
- A sample built with the part to support process or property verification.
Apply the evidence to a real part
Send the drawing and acceptance needs
A quotation is based on the actual geometry, material state, quantity, operating duty, finishing and inspection scope.